| abstract |
An object of the present invention is to impregnate a thin fiber substrate with a highly flexible resin with excellent adhesion to a metal foil or a fiber base material, so that it has excellent dimensional stability and heat resistance and is bent when used as a printed wiring board. It is possible to prevent a resin powder from falling off during processing, and to provide a printed wiring board having a good yield and a curable resin composition that gives the printed wiring board, a prepreg, a laminated board, a metal foil with an adhesive layer, and a film sheet. provide. A curable resin composition comprising an acrylic rubber (A), a thermosetting resin (B), and a filler (C). [Selection figure] None |