| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6bd0cdbc5c67cf4957ed83c89140748e |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C3-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C12-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C8-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-06 |
| filingDate |
2007-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbf54b8cffcfd96f3aaec1deec665913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_476703d6668e78e1df8d8a0113215faa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e1544b2c5c776ef2cd60cacec3ffa58 |
| publicationDate |
2008-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2008258338-A |
| titleOfInvention |
Thick film resistor paste, thick film resistor and method for forming the same |
| abstract |
PROBLEM TO BE SOLVED: To use a copper-nickel-based conductive powder, a harmful substance-free thick film resistor paste substantially free of harmful lead and cadmium, and a thickness having high adhesive strength with a ceramic substrate using the same A film resistor and a method for forming the same are provided. SOLUTION: A thick film resistor paste containing conductive powder made of copper and nickel, glass powder not containing lead and cadmium, and an organic vehicle, and iron mixed from a paste manufacturing apparatus such as a roll mill And the iron content in the paste is controlled to 100 mass ppm or less. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111763013-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013161770-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7245418-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010129896-A |
| priorityDate |
2007-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |