| abstract |
In a semiconductor device, a technique capable of achieving both improvement in mounting density and reduction in noise is provided. An LSI mounted on a printed wiring board has a ground BGA ball and a power BGA ball for receiving power from the printed wiring board. The ground BGA ball and the power The BGA balls 105a for use are adjacent to each other. A decoupling capacitor 103 is mounted on the printed wiring board 101, and the decoupling capacitor 103 has a terminal 113 and a terminal 114. The ground BGA ball 105b and the terminal 113 are connected by the metal electrode flat plate 110, the power supply BGA ball 105a and the terminal 114 are connected by the metal electrode flat plate 111, and the thickness is between the metal electrode flat plate 110 and the metal electrode flat plate 111. A dielectric film 112 of 1 μm or less is sandwiched. [Selection] Figure 1 |