Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0e7f7286c46e676b1bc0daf37b9f6c63 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2045-0079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-256 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-25 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2045-1702 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-1642 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1641 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-1701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-0013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-0053 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
filingDate |
2007-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_666ea39408927f040e0549acef77041a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17f36aeb0e6221ea73990a4a3a1b9993 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5b95d16b42d394e6a0529abe1f7f59e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_699e944f5522cfcf1296d718b6fec895 |
publicationDate |
2008-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2008255169-A |
titleOfInvention |
Plating film forming method, polymer member and manufacturing method thereof |
abstract |
PROBLEM TO BE SOLVED: To provide an inexpensive electroless plating film having high adhesion strength on the surface of various kinds of polymer members. SOLUTION: A method of forming a plating film on a polymer member, comprising: a polymer member having a plating film forming surface in which a metal substance is present and inert to an electroless plating solution at atmospheric pressure The above-mentioned problem is solved by providing a method for forming a plating film, which includes: forming a plating film on the polymer member by bringing an electroless plating solution containing pressurized carbon dioxide into contact with the polymer member. [Selection] Figure 5 |
priorityDate |
2007-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |