| abstract |
The present invention relates to a novel use of a diamondoid-containing material in the field of microelectronics. Embodiments include a heat conductive film of an integrated circuit package, a low-k dielectric layer of an integrated circuit multilayer wiring, a heat conductive adhesive film, and a thermoelectric cooling element. A field emission device including a heat conduction film, a passivation film for integrated circuit elements (ICs), and a field emission cathode. Diamondoids include lower diamondoids, and recently provided higher diamondoids, substituted and unsubstituted diamondoids. Diamondoid-containing materials may be processed as diamondoid-containing polymers, diamondoid-containing sintered ceramics, diamondoid ceramic composites, CVD diamondoid films, self-assembled diamondoid films, and diamondoid-fullerene composites. [Selection figure] None |