| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00 |
| filingDate |
2007-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ce945dc5d3c1d650d1f526fcd017b29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d2825c5d72be8595d43a103093ec8b5 |
| publicationDate |
2008-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2008251883-A |
| titleOfInvention |
Adhesive used in semiconductor device manufacturing method |
| abstract |
An object of the present invention is to provide an adhesive that can easily manufacture a semiconductor device without a void without depending on a substrate design. An adhesive according to the present invention die bonds a chip and a wiring substrate through an uncured adhesive, heats the wiring substrate to which the chip is die-bonded, and cures the uncured adhesive. When the semiconductor device is manufactured, the wiring board on which the chip is die-bonded is cured under the condition that the embedding index α represented by the following formula (1) is 75K −1 or less before the curing is completed. The adhesive is used in a method for manufacturing a semiconductor device including a step of applying a pressure and a hydrostatic pressing step, wherein the elastic modulus G at 120 ° C. is 30000 Pa or less. α = [G / (P × T)] × 10 6 (1) (In the formula, P represents pressure (Pa) relative to normal pressure, and T represents heating temperature (K).) [Selection] Figure 1-1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012153819-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012236992-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020524728-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011068887-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7018079-B2 |
| priorityDate |
2007-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |