http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008248240-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L75-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-58
filingDate 2008-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c03c8fea4365658bd80e7689119a8c42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_675c0bde000bf543127b13078815aa89
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publicationDate 2008-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008248240-A
titleOfInvention Thermosetting polyurethane resin composition
abstract PROBLEM TO BE SOLVED: To obtain a cured product having excellent heat resistance, electrical characteristics, mechanical properties and dimensional stability, excellent storage stability before curing, and publicly used in fields such as various heat resistant coating materials and electrical insulating materials. Providing a thermosetting resin composition capable of satisfying the requirements. A thermosetting resin composition comprising a polyurethane resin (A) having a structure represented by the following general formula (1) and / or the following general formula (2), an epoxy resin (B), and a phenoxy resin. object. [Chemical 1] [Chemical 2] (In the formula, X represents a residue obtained by removing a hydrogen atom from two phenolic hydroxyl groups of a phenolic compound having two or more phenolic hydroxyl groups in one molecule.) [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021256390-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101868177-B1
priorityDate 2007-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 28.