http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008244418-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate | 2007-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f62a820edc6182247d5a473962bd79a4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cf504410ff77bb35e8d9e615edcbf1b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d67169aef85e39791a3afd9b4da2600 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ad99a2ec5e1246f81073533d694b6d2 |
| publicationDate | 2008-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008244418-A |
| titleOfInvention | Resin sealing method for electronic component device and method for manufacturing electronic component device |
| abstract | An object of the present invention is to provide a resin sealing method for an electronic component device and a method for manufacturing the electronic component device, which are capable of reducing warpage and distortion caused by resin sealing and having excellent reliability. A step of preparing an electronic component device 1 having a semiconductor element 50 face-down connected to a wired circuit board 10 and a liquid sealing material containing a thermosetting resin between the wired circuit board 10 and the semiconductor element 50 The resin sealing method of the electronic component apparatus 1 provided with the process of interposing 100, and the microwave irradiation process of hardening the liquid sealing material 100 by microwave irradiation. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015050783-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9950450-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101568392-B1 |
| priorityDate | 2007-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 66.