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filingDate 2007-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d296cef402099b61ca6e9876c10beb8b
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publicationDate 2008-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008235669-A
titleOfInvention Semiconductor device and manufacturing method thereof
abstract The present invention provides a means for covering the periphery of a wire (gold wire or copper wire) with a cured product of a liquid resin composition with little conductive foreign matter so that an electrical short circuit failure due to the conductive foreign matter does not occur. In a semiconductor device in which a semiconductor element is connected to an inner lead of a metal lead frame or a circuit of an organic circuit board by a wire, the periphery of the wire is sealed with a cured product of a liquid resin composition. The semiconductor device is further sealed from above with a cured product 7 of a solid resin composition. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017168485-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018174298-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017168723-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170109479-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012209419-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018500439-A
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