| abstract |
An object of the present invention is to provide a PPS resin composition for encapsulating electronic parts, which is excellent in melt moldability, continuous moldability, and heat-and-moisture resistance by a PPS resin having a narrow molecular weight distribution and a reduced amount of metal impurities, and a molded product thereof. (A) The weight average molecular weight (Mw) is 10,000 or more, the dispersity represented by the weight average molecular weight / number average molecular weight (Mn) is 2.5 or less, and the alkali metal content is 50 ppm or less. The polyphenylene sulfide resin composition for electronic component sealing which is 5-60 volume% of a certain polyphenylene sulfide resin, and (b) 40-95 volume% of inorganic fillers. [Selection figure] None |