Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2cd796f8c4dcb425ddcc68707d3444 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
filingDate |
2007-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b994a9d0e27dfe5ee5ea5b24920afde http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_666680f5646defad712fcf627b36cc16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87e184bdc86eaccd457ffd76b625e4a7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67c7ebce5e7b407592403670fd8e6a74 |
publicationDate |
2008-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2008229866-A |
titleOfInvention |
Adhesive film and semiconductor device |
abstract |
PROBLEM TO BE SOLVED: To provide a heat resistant adhesive film useful for a DAF: die attachment film capable of realizing a highly durable semiconductor package. [MEANS FOR SOLVING PROBLEMS] A polyimide film (layer b) having a pyromellitic acid residue as an aromatic tetracarboxylic acid residue and a diamine residue having a benzoxazole skeleton as an aromatic diamine residue is logarithmic as an adhesive. It is an adhesive film in which a polyamideimide resin layer (a layer) having a viscosity of 0.1 dl / g or more and copolymerized with a dimer acid is laminated, and has a linear expansion coefficient of −5 to 10 ppm / ° C. in the surface direction of the polyimide film. It is preferable that [Selection figure] None |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115175816-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109796889-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018076494-A |
priorityDate |
2007-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |