http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008222923-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad8be5613da19d081abd4348946c0408 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 |
filingDate | 2007-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36305b1d50ec8f6c395648dad055a830 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7afa7e22e23f972bc7e4421768bad0a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e99233503786cbfb21b729d1ea51855 |
publicationDate | 2008-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2008222923-A |
titleOfInvention | Low heat-shrinkable and highly adhesive polyimide film and method for producing the same. |
abstract | Disclosed are a polyimide film having improved heat shrinkage and improved adhesion and a method for producing the same. SOLUTION: (1) Polyimide obtained from 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether and pyromellitic dianhydride, and (2) a particle diameter in the range of 0.01 to 1.5 μm. Inorganic film having an average particle diameter of 0.05 to 0.7 μm is a polyimide film comprising 0.1 to 0.9% by weight with respect to the weight of the polyamic acid, and the length of the film A heat treatment while maintaining a constant tension in the vertical direction and a discharge treatment were sequentially performed, and the surface free energy measured based on the contact angle method was 80 mN / m or more, and the heat shrinkage rate at 200 ° C. for 1 hour was 0. 10% or less. [Selection figure] None |
priorityDate | 2007-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 243.