| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7af673589ca45d2fd8b9ea902cdbd1dc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-073 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F02M47-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-508
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F02M63-0026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-503 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02N2-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F02M51-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-39
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-083
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F02M51-06 |
| filingDate |
2007-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3373aaf1d0fe46a1cc3be668435762de
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a1036243da688d5091b63a9c0d4c5e1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74535feb06b4b93de4b1ab12443ba53a |
| publicationDate |
2008-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2008218864-A |
| titleOfInvention |
Multilayer piezoelectric element |
| abstract |
Provided is a multilayer piezoelectric element capable of suppressing performance degradation in a high temperature atmosphere. A multilayer piezoelectric element formed by stacking a plurality of unit laminate bodies 15 in which ceramic layers 151 and internal electrode layers 153 and 154 are alternately laminated and bonding the unit laminate bodies 15 with a bonding material layer 13. 1. The bonding material layer 13 has a thickness of 1 μm or less and an adhesive strength of 1.3 MPa or more. Moreover, it is preferable that the bonding material layer 13 is formed by curing a silicone resin adhesive containing an organic peroxide. [Selection] Figure 3 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101877505-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180012685-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11518165-B2 |
| priorityDate |
2007-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |