http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008214749-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_32c182780ae8fd1eabf081eb5ef98479 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f084eba795dfe0bfc657a179e597d4c7 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 |
filingDate | 2008-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4529e8f920a043b2ca4459ca3fffe6e0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1fc7c36315bd92ddc42efa5ed8e0b544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdafc065fa07633a831e66ca3a18bb98 |
publicationDate | 2008-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2008214749-A |
titleOfInvention | Electroless plating forming material, catalyst adhesion coating solution, electroless plating forming method, and plating method |
abstract | [PROBLEMS] To achieve good adhesion to a catalyst and to prevent a catalyst adhesion layer from peeling off from a non-conductive substrate or eluting into a plating solution in a catalyst adhesion process, a development process or other processes, and further to provide insulation. An electroless plating forming material excellent in the above is provided. In an electroless plating forming material having a catalyst adhesion layer on a non-conductive substrate, the catalyst adhesion layer includes a hydrophilic monomer having a self-crosslinking property as a constituent monomer. Is configured to include. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021166726-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011116987-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016003370-A |
priorityDate | 2007-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 70.