http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008214549-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
filingDate 2007-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3156a51f8a6c868a372db5f71d4c78f2
publicationDate 2008-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008214549-A
titleOfInvention Phenolic resin molding material
abstract PROBLEM TO BE SOLVED: To provide a phenol resin molding material capable of obtaining a molded product with less generation of burrs. SOLUTION: A phenol resin molding material having a novolac type phenol resin (a), a curing agent (b) and a filler (c) as essential components, wherein the filler (c) has a thermal conductivity of 30 W / mK or more. And a phenol resin molding material having an average particle diameter of 50 μm or more and 100 μm or less. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013160899-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10428253-B2
priorityDate 2007-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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