| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3592ad777b344e296b913493b43db6c6 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E30-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G21D3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G21D1-00 |
| filingDate |
2008-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d8e1b6d652a369d1f7dba338f7afa59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30c22bec210c754e4cdfe68b1bd24d28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c83be1b6f0a3f60527bca83cf96ae86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_276cafbaef05db2b4c2234f3714f5eee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5dc17b6810fefc0b4ad5b44cc1a37f6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12076f7f92e3863c93a0d876609492b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ad4568d1c592ebb8a75934fb914fccd |
| publicationDate |
2008-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2008209418-A |
| titleOfInvention |
Radionuclide adhesion suppression method and film forming apparatus for nuclear plant components |
| abstract |
The present invention provides a method for effectively suppressing the attachment of radionuclides to nuclear plant components and reducing the amount of ion exchange resin waste used for waste liquid treatment after formation of a ferrite film. SOLUTION: An iron (II) ion, an organic acid (formic acid) in which iron is dissolved to form iron (II) ion, an oxidizing agent (hydrogen peroxide) that oxidizes iron (II) ion to iron (III) ion ) And a pH adjusting agent (hydrazine) adjusted to a pH of 5.5 to 9.0 is brought into contact with the surface of a metal member constituting the nuclear power plant, and iron (II) ions are adsorbed on this surface. Let The adsorbed iron (II) ions are oxidized under a temperature condition of 20 ° C. to 200 ° C. to form a ferrite film on the surface of the metal member. After the formation of the ferrite film, the pH adjuster and the organic acid contained in the treatment liquid used for forming the ferrite film are decomposed using a decomposition apparatus to which an oxidizing agent is supplied. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008180740-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4567542-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4607775-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007024644-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010127788-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8652272-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007192672-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4567765-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007192745-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8652271-B2 |
| priorityDate |
2008-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |