| abstract |
An adhesive composition capable of forming an adhesive film having heat resistance and moisture resistance necessary for mounting a semiconductor element having a large difference in thermal expansion coefficient on a semiconductor mounting substrate, and capable of suppressing volatile components during use. An adhesive film using the adhesive composition, a semiconductor mounting substrate, and a semiconductor device are provided. The method comprises (a) an epoxy resin, (b) a curing agent, and (c) a polymer compound that is incompatible with the epoxy resin, and (d) a filler and / or (e) as necessary. Adhesive composition containing a curing accelerator, method for producing the adhesive composition, an adhesive film formed by forming the adhesive composition into a film, and semiconductor mounting including the adhesive film on a chip mounting surface of a wiring board And a semiconductor device using the adhesive film or the semiconductor mounting substrate. [Selection figure] None |