http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008201941-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad8be5613da19d081abd4348946c0408 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 |
filingDate | 2007-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e57258b06c6b8ad3a850a22798821b3d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e99233503786cbfb21b729d1ea51855 |
publicationDate | 2008-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2008201941-A |
titleOfInvention | Low heat shrinkable polyimide film and method for producing the same. |
abstract | A polyimide film having improved heat shrinkage and a method for producing the same are provided. The polyimide film of the present invention comprises (1) a polyimide obtained from 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether and pyromellitic dianhydride; A polyimide film comprising 0.1 to 0.9% by weight of inorganic particles in the range of 01 to 1.5 μm and having an average particle diameter of 0.05 to 0.7 μm based on the weight of the polyamic acid. It is. The polyimide film is subjected to a heat treatment while maintaining a constant tension in the length direction of the film, and has a heat shrinkage rate of 0.10% or less at 200 ° C. for 1 hour. The present invention also includes a method for producing this polyimide film. [Selection figure] None |
priorityDate | 2007-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 241.