http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008201823-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7af673589ca45d2fd8b9ea902cdbd1dc http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_915269922949d81a90260e5cd5d2df40 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-04 |
filingDate | 2007-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14faeaf33482549c29b1e45189f16965 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8b8f9896a47ed94adb6f8504043fc0c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a5b328c95937565a49826a4197b4335 |
publicationDate | 2008-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2008201823-A |
titleOfInvention | Epoxy resin composition and electrical and electronic parts using the same |
abstract | An epoxy resin composition excellent in dielectric breakdown resistance and heat resistance and an electric / electronic component using the same are provided. An epoxy resin composition includes an epoxy resin, an epoxy curing agent, and clay, and the clay includes at least the following general formula (1): (R 1 to R 4 each independently represent hydrogen, an aliphatic hydrocarbon, an alicyclic hydrocarbon, or an aromatic hydrocarbon group, and at least one is an alkyl group or alkenyl group having 8 to 16 carbon atoms. It is characterized by being an organically treated clay treated with an onium salt. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102347309-B1 |
priorityDate | 2007-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 202.