| abstract |
PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor encapsulation excellent in soft error prevention by high energy neutrons. SOLUTION: (A) A neutron moderator including an epoxy resin (A1), a phenolic resin (A2), and an organic filler (A3), and (B) a neutron absorber in which particles of 100 μm or more are 1% by weight or less. The resin composition for semiconductor encapsulation characterized by containing, More preferably, the said organic filler (A3) is 1 or more types chosen from silicone resin, polyacrylic acid ester, and polymethacrylic acid ester, B) A resin composition for encapsulating a semiconductor, wherein the neutron absorbing material in which particles of 100 μm or more are 1% by weight or less is at least one selected from a boron compound (B1), a cadmium compound (B2), and a samarium compound (B3) . [Selection figure] None |