| abstract |
【Task】 Residues derived from resist remaining after dry etching and / or residues derived from metals such as copper and aluminum in semiconductor integrated circuits, liquid crystal panels, organic EL panels, printed boards, etc., especially wiring boards containing titanium and / or titanium alloys The present invention provides a residue removing composition capable of removing an object without corroding titanium and / or a titanium alloy. [Solution] (1) 15 wt% to 20 wt% hydrogen peroxide, (2) 0.1 wt% to 10 wt% quaternary ammonium hydroxide, (3) 0.05 to 5 wt% inorganic acid, (4) 0.0001 wt% A residue-removing composition is used that contains a stabilizer of% to 0.1% by weight of hydrogen peroxide and has a pH of 8-9. [Selection] Figure 1 |