| abstract |
A positive photosensitive resin composition having excellent adhesion to a substrate after development and humidity treatment and storage stability, and a cured product of the positive photosensitive resin composition. It is another object of the present invention to provide a protective film, an insulating film, a semiconductor device, and a display device that are made of the cured film. A positive photosensitive resin composition comprising an alkali-soluble resin (A), a photosensitive diazonaphthoquinone compound (B), and a silicon compound (C-1) represented by the general formula (1) is provided. The above problem is solved. [Chemical 1] [Selection figure] None |