| abstract |
A method for producing a metallized film capable of forming a metal layer having a uniform thickness and excellent surface properties by covering the inside of a defect hole is provided. A method of manufacturing a metallized film in which a metal layer 4 is formed on the surface of an insulator 1, the step of forming a base metal film 4 on the surface of the insulator 1 by a dry plating method, 1 By contacting an organic monomer-containing liquid with the surface on which the base metal film 4 is formed, and selectively forming a conductive organic polymer film on the surface of the insulator 1 in the defect hole of the base metal film 4, And a coating step. [Selection] Figure 3 |