http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008189852-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2007-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06e49c4357ba9a177f5e381a5f0d41bf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57003384f6b234c192e0cc572ca914ab http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e35a46f85b3e2b946ac3edf1cabaa65 |
| publicationDate | 2008-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008189852-A |
| titleOfInvention | Thermosetting resin composition and method for producing printed wiring board using the same |
| abstract | The present invention relates to a thermosetting resin composition that can be easily removed by chemical treatment instead of physical removal after filling a hole or recess of a printed wiring board and thermosetting, and uses the same. A printed wiring board manufacturing method and a printed wiring board are provided. A thermosetting resin composition includes (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a resin having a urethane bond that is easily decomposed by an oxidizing agent, particularly a carboxyl group or an acid. A polyimide resin having an anhydride group and having a linear hydrocarbon structure having a number average molecular weight of 700 to 6,000, (C) an epoxy curing agent, and (D) a filler are contained as essential components. After filling this composition into the hole between the plated through hole 2 and the like of the printed wiring board 1 and the recess between the conductor circuit layers 3 and heat-curing, the surface portion of the cured composition layer is treated by oxidizing treatment. The conductive circuit pattern is exposed to be removed and the surface of the substrate is flattened. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013019092-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013019092-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011181628-A |
| priorityDate | 2007-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 63.