| abstract |
PROBLEM TO BE SOLVED: To improve the adhesion between a high heat-resistant polyimide film and an adhesive polyimide layer and at the same time improve the solder heat resistance, and a substrate for a single-sided metal-clad laminate, and the single-sided metal It aims at providing the manufacturing method of the single-sided metal-clad laminate using the base material for tension laminates. A substrate for a single-sided metal-clad laminate, comprising an adhesive polyimide layer on one side of a high heat-resistant polyimide film and a non-adhesive polyimide layer on the other side, wherein the high-heat-resistant polyimide film has a high heat resistance. The base material for a single-sided metal-clad laminate, wherein the conductive polyimide film contains a thermoplastic polyimide block component in an amount of 20 to 60 mol% of the whole polyimide, and the substrate for a single-sided metal-clad laminate and a metal foil The above problem can be solved by a method for producing a single-sided metal-clad laminate, which is characterized by being laminated. [Selection figure] None |