http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008184585-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 |
| filingDate | 2007-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_096e79fe344855559ec13ac6997d4bbe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06fa786214dc7c4520b67a8be765723c |
| publicationDate | 2008-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008184585-A |
| titleOfInvention | Semiconductor sealing resin composition and semiconductor device using the same |
| abstract | The present invention provides a resin composition for encapsulating a semiconductor, which has high fluidity even in high filling with an inorganic filler, suppresses the occurrence of wire flow during molding, and has excellent moldability. A resin composition for encapsulating a semiconductor comprising a thermosetting resin, a curing agent and an inorganic filler, wherein the inorganic filler contains an inorganic powder (A) shown below as a main component. (A) An inorganic powder composed of the following (a1) and (a2), the ratio of which is set to a weight ratio of [(a1) / (a2)] = 99/1 to 70/30 Inorganic powder. (A1) Inorganic powder having two maximum frequency values in the region of 2.0 to 100.0 μm in the volume frequency particle size distribution, and the frequency value on the smaller particle size side of the two maximum frequency values The ratio of the frequency value on the larger particle size side to 4.0 to 9.0 is an inorganic powder. (A2) An inorganic powder having one maximum frequency value in a region of 0.1 μm or more and less than 2.0 μm in the volume frequency particle size distribution. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016079195-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022202592-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016056263-A1 |
| priorityDate | 2007-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.