http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008184584-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2007-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06fa786214dc7c4520b67a8be765723c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_096e79fe344855559ec13ac6997d4bbe |
| publicationDate | 2008-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008184584-A |
| titleOfInvention | Semiconductor sealing resin composition and semiconductor device using the same |
| abstract | A resin composition for encapsulating a semiconductor that has high fluidity even in the high filling of an inorganic filler when molding a thin semiconductor package, suppresses the occurrence of wire flow during molding, and has excellent moldability. And a semiconductor device using the same. A resin composition for encapsulating a semiconductor comprising a thermosetting resin, a curing agent and an inorganic filler, wherein the inorganic filler contains an inorganic powder (A) shown below as a main component. (A) An inorganic powder composed of the following (a1) and (a2), the ratio of which is set to a weight ratio of [(a1) / (a2)] = 99/1 to 70/30 Inorganic powder. (A1) An inorganic powder having two maximum frequency values in an area of 2.0 to 100.0 μm in the volume frequency particle size distribution and having a space ratio ε of less than 40%. (A2) An inorganic powder having one maximum frequency value in a region of 0.1 μm or more and less than 2.0 μm in the volume frequency particle size distribution. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113228707-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113228707-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016079195-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016056263-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9919930-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022202592-A1 |
| priorityDate | 2007-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.