| abstract |
PROBLEM TO BE SOLVED: To provide a balance of physical properties (flexibility, high elongation, high flexibility, base material) that can be suitably used as a coating forming material for coating an electronic material, particularly a conductor circuit pattern. An object of the present invention is to provide a thermosetting resin composition excellent in adhesiveness, high insulation, and environmental stability. (A) a polyimide resin having at least a specific structure; (B) thermosetting resin, The above problem can be solved by using a thermosetting resin composition characterized by containing (C) inorganic or organic fine particles and (D) an organic solvent. [Selection figure] None |