http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008177532-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d231147f38595bbe3114b758cba4a298
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
filingDate 2007-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dbb0602aa14ba438d5ab261c34ee241
publicationDate 2008-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008177532-A
titleOfInvention Semiconductor wafer processing method
abstract In a rework process for removing a silicon-containing organic film formed on a semiconductor wafer substrate, a silicon compound residue is generated, which is difficult to remove. At least a first step of cleaning a surface from which a silicon-containing organic film formed on a semiconductor wafer substrate has been removed with an aqueous ammonia solution and a second step of cleaning the surface with a diluted hydrofluoric acid aqueous solution are provided. Process with the method you have. The ammonia concentration in the aqueous ammonia solution is preferably 0.01 weight percent or more and 30 weight percent or less. The concentration of hydrofluoric acid in the diluted hydrofluoric acid aqueous solution is preferably 0.01 weight percent or more and 2.0 weight percent or less. [Selection] Figure 1
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priorityDate 2006-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007280982-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004214587-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006156906-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004095899-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID25517
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID977
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14923
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419517548
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID411556313
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6431
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID13129
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14917
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451203358
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID448674543
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID11729320
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453327643
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419523291
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID222
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457280313
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6373
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419546198
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419546554
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419550829
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID11638

Total number of triples: 46.