abstract |
The present invention is integrated with a light-emitting element (one chip), structurally does not require a regrowth process of a compound semiconductor layer, and is effective against destruction caused by forward and reverse overcurrent flow. A light emitting device assembly having protective means is provided. A light emitting device assembly includes a bypass diode formed on a substrate, a light emitting device formed thereon, and a reverse formed separately from the light emitting device above the substrate. A directional diode 40 is provided. [Selection] Figure 1 |