http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008177373-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_10cfc10171f0e204339e96e62a544ce0 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2007-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_100e7d526cf8ae65dd50698a5c9a49b1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3118ef266ae55ee177a4b1c3921a70ac |
| publicationDate | 2008-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008177373-A |
| titleOfInvention | Polishing composition |
| abstract | PROBLEM TO BE SOLVED To provide a polishing composition capable of suppressing dishing and capable of higher speed polishing. The polishing composition of the present invention is a polishing composition suitable for a metal film, particularly a copper (Cu) film, which contains ammonia, an ammonium salt, hydrogen peroxide and an amino acid, with the balance being water. As an ammonium salt, ammonium chloride and ammonium carbonate are preferable, and as an amino acid, an acidic amino acid and a hydroxyamino acid are preferable. [Selection figure] None |
| priorityDate | 2007-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.