http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008177214-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ead90443277482e25bf91bfddef2b5a7 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 |
| filingDate | 2007-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75e8bfc1888cb781d98dbd433554edcd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32959175328acb9d973e361fa556d5c7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3374190339cf2bbe16ba55a2d2f6891 |
| publicationDate | 2008-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008177214-A |
| titleOfInvention | Laminated body for flexible circuit board and manufacturing method thereof |
| abstract | Provided is a laminate for a wiring board that has a practical mechanical strength and can sufficiently prevent disconnection of a conductor circuit when it is repeatedly bent. A laminate for a flexible circuit board having an ultrathin metal foil having a thickness of 0.1 to 5 μm on one or both sides of a polyimide insulating layer having a thickness of 3 to 7 μm. This flexible circuit board laminate has a polyimide insulating layer having a thickness of 3 to 7 μm on the ultrathin metal foil by applying a polyimide precursor resin in a solution state on the ultrathin metal foil with carrier and heat-treating it. Is obtained, and then the carrier is peeled from the multilayer laminate. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013216079-A |
| priorityDate | 2007-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 111.