http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008173979-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d93502a23a72b56472bc75854cfe7c60 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G61-08 |
filingDate | 2008-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b0af0a8faa1e12b1932efce8feb6c09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7bf0b5ab736f89208dee6f4a50d67f37 |
publicationDate | 2008-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2008173979-A |
titleOfInvention | Laminated body |
abstract | Provided are a laminated body having a small dielectric loss tangent, a small influence of temperature and humidity of the dielectric loss tangent, and less likely to be peeled off due to generation of blisters, and an electric circuit board including the laminate. A polymerizable composition containing a cycloolefin monomer, a metathesis polymerization catalyst, a chain transfer agent and a cross-linking agent is cast on a support, and then bulk metathesis polymerization is performed to obtain a film-like molded product. A conductive wiring layer is laminated on the surface of the molded body by plating or the like, and then an amorphous carbon film is laminated on the wiring layer to obtain a laminated body. This laminate is stacked several times to obtain an electric circuit board. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011074271-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010047349-A1 |
priorityDate | 2008-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 250.