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filingDate 2007-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2008-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008172054-A
titleOfInvention Semiconductor sealing resin composition and semiconductor device
abstract PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor encapsulation excellent in soft error prevention by high energy neutrons. A resin composition for encapsulating a semiconductor, comprising (A) a neutron moderator, and (B) a neutron absorber in which particles of 100 μm or more are 1% or less, more preferably (A) The neutron moderator is (A1) epoxy resin and / or (DA2) phenolic resin, and (B) neutron absorber in which particles of 100 μm or more are 1% or less is (B1) boron compound, (B2) cadmium The resin composition for semiconductor sealing which is 1 or more types chosen from a compound and (B3) samarium compound. [Selection figure] None
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