http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008171942-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 |
| filingDate | 2007-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c736e7df66afe93f2da42c6d66abc69 |
| publicationDate | 2008-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008171942-A |
| titleOfInvention | Electronic device and manufacturing method thereof |
| abstract | A highly reliable electronic device and a manufacturing method thereof are provided. An electronic device includes a wiring substrate having a base substrate and a wiring pattern, a semiconductor chip on which an electrode is formed, and a resin protrusion formed on a surface of the semiconductor chip on which an electrode is formed. 30 and the wiring 40 electrically connected to the electrode including the electrical connection portion 42 formed on the resin protrusion, and the wiring board is arranged so that the electrical connection portion contacts the wiring pattern. It includes a mounted semiconductor device 3 and an adhesive 4 for bonding the wiring board and the semiconductor device. The wiring 40 includes a first layer 44 and a second layer 46 formed on the first layer and made of a material having higher ductility than the first layer. A crack is formed in a region overlapping with the resin protrusion in the first layer, and a crack is not formed in a region overlapping with the resin protrusion in the second layer. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011108837-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008186836-A |
| priorityDate | 2007-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.