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filingDate 2007-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2008-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008168595-A
titleOfInvention Package using copolymer film and adhesive cutting method using copolymer film
abstract An object of the present invention is to improve the aesthetics and durability of a package in packaging using a biodegradable plastic film. A biodegradable 1,4-butanediol, succinic acid, adipate and lactic acid copolymer film (1,4-butanediol, succinic acid, adipate, lactic acid) is used. In the packaged body, by using a thermoplastic rubber-based hot-melt adhesive melted at a temperature of 140 ° C. to 160 ° C., the package is burnt and the packages after the adhesion are peeled off. The package parts other than the weld cut part by the heat of the blade by eliminating the generation and welding and cutting the package bodies using a cross cutter having a blade heated to a temperature of 220 ° C. to 230 ° C. Occurrence of melting and peeling of the welded and cut portions of the packages after welding and cutting were eliminated. [Selection] Figure 2
priorityDate 2007-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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