http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008166521-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0912daf116f0bcac3d0ceb324ab8c742
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04N5-335
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-14
filingDate 2006-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_552ffbde7ef70c0cfa34be1b07094161
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a3ea1c75f16ac7846976f992066a92f
publicationDate 2008-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008166521-A
titleOfInvention Solid-state imaging device
abstract A solid-state image pickup device is reduced in size and thickness, and the cost is reduced. A wiring board is a multilayer wiring board formed by an optical device unit mounted on a second surface. A connection land portion facing the pad electrode of the solid-state image sensor 1 is formed around the translucent area 8 on the first surface of the wiring board 2, and has a translucent area 8 for guiding the subject image to the solid-state image sensor 1. A solid-state imaging device which is electrically connected via an electrode 3 and has a light-transmitting region 8 formed by an optical filter layer 2 a constituting the wiring substrate 2. [Selection] Figure 2
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009157356-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I716469-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018060129-A
priorityDate 2006-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426099546
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Total number of triples: 17.