http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008166322-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2006-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2a2dab7b88c65d4387d02edc2edda9c |
| publicationDate | 2008-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008166322-A |
| titleOfInvention | Insulating resin composition, insulating resin sheet with substrate, multilayer printed wiring board, and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide an insulating resin composition for a multilayer printed wiring board having a low thermal expansion coefficient and a low melt viscosity and further having excellent flame retardancy, and further an insulating layer comprising the insulating resin composition on a substrate. An insulating resin sheet with a base material formed on a multilayer substrate, a multilayer printed wiring board excellent in plating adhesion and insulation reliability, and a semiconductor device excellent in reliability are provided. An insulating resin sheet insulating resin composition for a multilayer printed wiring board comprising the components (A) to (D) as essential components. (A) Bisphenol A / bisphenol F weight ratio of 1/9 to 1/1 copolymerized epoxy resin of bisphenol A and bisphenol F, (B) thermosetting resin having a softening point of 80 ° C. or lower, (C A curing agent and (D) an inorganic filler. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4911795-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012009606-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101148225-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2010024391-A1 |
| priorityDate | 2006-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 75.