http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008159898-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-44 |
| filingDate | 2006-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da965d012169cde473e7e884f63ed902 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_961529f2767ab17d148c2a516b5ea5bf |
| publicationDate | 2008-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008159898-A |
| titleOfInvention | Wiring circuit board and manufacturing method thereof |
| abstract | To provide a printed circuit board and a method for manufacturing the same, which can efficiently remove electrostatic charges and reliably prevent electrostatic breakdown of mounted electronic components. In a suspension board with circuit 1, a first semiconductive layer 5 is electrically connected to a surface of a base insulating layer 3 exposed from the conductor pattern 4 with the conductor pattern 4 and the metal supporting board 2. The second semiconductive layer 7 is formed on the surface of the insulating cover layer 6 so as to be electrically connected to the metal support substrate 2. By the first semiconductive layer 5 and the second semiconductive layer 7, static electricity charged in the conductor pattern 4, the base insulating layer 3 and the cover insulating layer 6 is grounded to the metal supporting substrate 2 and efficiently removed. It is possible to reliably prevent electrostatic breakdown of electronic components to be mounted. [Selection] Figure 2 |
| priorityDate | 2006-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.