Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-20 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-743 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68771 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68785 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-82 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C15-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-8404 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-687 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-855 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6875 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y10-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-84 |
filingDate |
2006-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76aecc0898062f0a5ceed8e297ceee68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9064b7fccaa89bb17248c55cd1e9173c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba0f39e5680cc6a9635fad5bd12e03cb |
publicationDate |
2008-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2008159097-A |
titleOfInvention |
Substrate holder, substrate etching method, and magnetic recording medium manufacturing method |
abstract |
An uneven pattern is efficiently formed on recording layers on both sides of a magnetic recording medium. An insulating member having a concave portion for holding a substrate to be etched and a through hole formed immediately below the concave portion, and a conductor member having a convex portion engaging with the through hole, A gap is formed between the surface of the convex part and the bottom surface of the substrate in a state where the substrate to be etched is placed in the concave part, and the thickness of the gap part is 0.05 mm or more and 1 mm or less, and Processing is performed using a substrate holder characterized in that the insulator member has a thickness of 1 mm to 15 mm. [Selection] Figure 2 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11195700-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105762092-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010061717-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014241394-A |
priorityDate |
2006-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |