http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008156559-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad8be5613da19d081abd4348946c0408 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 |
| filingDate | 2006-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d0c8b5075d7abac351d0dcd7f3bacddd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b2a2302481868d342bd5435d3f4e386 |
| publicationDate | 2008-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008156559-A |
| titleOfInvention | High adhesion copolymer polyimide film |
| abstract | The present invention provides a highly adhesive copolymerized polyimide film having improved adhesion to copper foil and excellent slipperiness, dimensional stability, and water wettability. A polyimide film formed from 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, and pyromellitic dianhydride is subjected to a sand mat treatment, a relaxation treatment, and then a plasma. It is a polyimide film formed by treatment, and the heat shrinkage at 200 ° C. is 0.05% or less in both the machine transport direction (MD) and the width direction (TD) of the film. A highly adhesive polyimide film having a surface roughness Ra measured by a thickness meter of 0.065 μm or more, Rmax of 1.0 μm or more, and a surface free energy measured by a contact angle method of 80 mN / m or more. [Selection figure] None |
| priorityDate | 2006-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.