| abstract |
[Object] To prevent voids from entering between a pressure-sensitive adhesive layer and an adhesive layer, so that it can be bonded to a wafer without any problem, can be diced, and easily after the dicing process is completed. A wafer processing tape that can be peeled off is provided. In manufacturing a semiconductor device, there are 10 wafer processing tapes that are used in an adhesion process for fixing, dicing, and superposing a wafer with a lead frame or a semiconductor chip. The tape 10 is provided with the pressure-sensitive adhesive layer 2 on the base film 3, a dicing ring frame sticking portion is formed on the pressure-sensitive adhesive layer 2, and a dicing ring frame sticking portion of the pressure-sensitive adhesive layer 2 is further formed. The adhesive layer 1 is provided corresponding to the inner wafer bonding portion, and the through hole 9 is provided in the outer edge of the adhesive layer so as to penetrate the base film 3 and the pressure-sensitive adhesive layer 2. Featured tape for wafer processing. [Selection] Figure 1 |