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classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-00
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00
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filingDate 2006-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_599ccb889dafd40712de3ad979128fd7
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publicationDate 2008-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008146999-A
titleOfInvention Method for forming finely shaped conductor of copper-based fine particle sintered body type
abstract A copper fine particle dispersion having a surface oxide film layer is used to reduce copper fine particles or copper oxide fine particles contained in a coating film at a relatively low temperature after drawing a fine pattern. Provided is a method for forming a finely shaped conductor of a sintered copper fine particle type exhibiting excellent conductivity by firing the produced copper fine particles. A metal having a catalytic activity for hydrogenation reaction, or a metal salt after coating a dispersion containing copper fine particles or copper oxide fine particles having a surface oxide film layer having an average particle diameter of 1 to 100 nm on a substrate; In the presence of hydrocarbon having hydrogen donating ability, in an atmosphere containing hydrogen molecules, heated to a temperature of 150 ° C. or higher and 300 ° C. or lower, and subjected to reduction of the oxide film by a reduction reaction using hydrogen molecules as a reducing agent, The process of forming the sintered compact layer of the obtained copper fine particles is carried out by a series of heat treatment processes. [Selection figure] None
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