http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008146999-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d437b2abb428aeb59000da0b15dc2f98 |
classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-00 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
filingDate | 2006-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_599ccb889dafd40712de3ad979128fd7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_085e66330372b15cf05f21d5f3093939 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e07edfd70ef0c2ca7db30263b61e0931 |
publicationDate | 2008-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2008146999-A |
titleOfInvention | Method for forming finely shaped conductor of copper-based fine particle sintered body type |
abstract | A copper fine particle dispersion having a surface oxide film layer is used to reduce copper fine particles or copper oxide fine particles contained in a coating film at a relatively low temperature after drawing a fine pattern. Provided is a method for forming a finely shaped conductor of a sintered copper fine particle type exhibiting excellent conductivity by firing the produced copper fine particles. A metal having a catalytic activity for hydrogenation reaction, or a metal salt after coating a dispersion containing copper fine particles or copper oxide fine particles having a surface oxide film layer having an average particle diameter of 1 to 100 nm on a substrate; In the presence of hydrocarbon having hydrogen donating ability, in an atmosphere containing hydrogen molecules, heated to a temperature of 150 ° C. or higher and 300 ° C. or lower, and subjected to reduction of the oxide film by a reduction reaction using hydrogen molecules as a reducing agent, The process of forming the sintered compact layer of the obtained copper fine particles is carried out by a series of heat treatment processes. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11532588-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10930612-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012128139-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015129351-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108265280-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012007141-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012007140-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3703140-A4 |
priorityDate | 2006-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 105.