http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008144052-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B1-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-58 |
| filingDate | 2006-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e974b0c51fbf4c14536ee3514b8f3c76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1a4b5cb6222141a6e8743922d9cda78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c90bfa218e79c351cd8eb151f8984fae |
| publicationDate | 2008-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008144052-A |
| titleOfInvention | Epoxy resin composition for molding optical members |
| abstract | Provided is an epoxy resin composition for molding an optical member, which can obtain an optical member such as a microlens sheet that does not cause unevenness in luminance due to deformation or the like under a high temperature and high humidity environment. An epoxy resin composition for molding an optical member containing the following components (A) to (C). (A) The epoxy resin which has following (a1) and (a2) as a main component, and the content rate of (a1) is set to 30 to 50 weight% of the whole epoxy resin composition. (A1) A bisphenol A type epoxy resin having an epoxy equivalent of 3500 or more. (A2) At least one of dicyclopentadiene type epoxy resin and biphenyl type epoxy resin. (B) An acid anhydride curing agent mainly composed of an alicyclic acid anhydride. (C) A curing accelerator mainly composed of an imidazole compound. [Selection figure] None |
| priorityDate | 2006-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.