| abstract |
[PROBLEMS] To provide excellent heat dissipation, suppress physical stress, less liquid silicone exudation, and excellent adhesion and adhesion to each component and substrate. An object of the present invention is to provide a composition for heat-dissipating silicone gel and a heat-dissipating silicone sheet obtained by curing the composition. An alkenyl group-containing polyorganosiloxane, a diorganohydrogensiloxy-terminated polyorganosiloxane as a chain extender, a polyorganohydrogensiloxane as a crosslinking agent, a hydrosilylation catalyst and a thermally conductive filler, and comprising an alkenyl group-containing polyorgano Curing in which the ratio between the number of alkenyl groups bonded to silicon atoms in the siloxane and the number of hydrogen atoms bonded to silicon atoms in the chain extender and the number of hydrogen atoms bonded to silicon atoms in the crosslinker is specific A heat dissipating silicone gel composition and a heat dissipating silicone sheet obtained by curing the composition. [Selection figure] None |