| abstract |
[PROBLEMS] To provide characteristics suitable for nanoimprinting, that is, the ability to relieve imprint conditions at high pressure during thermal imprinting, reduce damage to the mold (mold), and further relieve imprinting conditions at high temperatures. The present invention provides a negative resist composition for nanoimprint lithography having good mold transferability. A negative resist composition for nanoimprint lithography comprising a polyfunctional epoxy resin (A) having a softening point of 30 to 70 ° C., a cationic photopolymerization initiator (B), and a solvent (C). . [Selection figure] None |