| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2006-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e50d403e5f8f3a4c49252d0734d47a45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b63a11afeaf10001ea2bd0c469c3ed51
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0208d011f51c185d48656d91f4e1f725 |
| publicationDate |
2008-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2008135453-A |
| titleOfInvention |
Polishing composition and polishing method |
| abstract |
A polishing composition more suitable for use in polishing a wafer containing tungsten and a polishing method using the polishing composition are provided. The polishing composition of the present invention contains colloidal silica and hydrogen peroxide. The pH of the polishing composition is 5 to 8.5, and the iron ion concentration in the polishing composition is 0.02 ppm or less. It is preferable that the polishing composition further contains phosphoric acid or a phosphate. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9303191-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013147046-A1 |
| priorityDate |
2006-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |