| abstract |
Disclosed is an adhesive sheet for a semiconductor which can hardly be deteriorated in quality during storage and can obtain high bonding reliability after heat curing, and an electronic component assembly using the same. A silane cup having an epoxy compound (A), a polymer (B) having a functional group that reacts with an epoxy group, a curing agent (C), and a cyclic hydrocarbon skeleton including a functional group that reacts with the epoxy group. From a ring agent, a silane coupling agent having a functional group that reacts with an epoxy group and a cyclic hydrocarbon skeleton adjacent to the functional group, a silane coupling agent having a secondary amino group, and a silane coupling agent having a tertiary amino group The adhesive sheet 6 for semiconductors which consists of a thermosetting resin composition containing the at least 1 sort (s) of silane coupling agent (D) chosen from the group which consists of, and electronic component conjugate | zygote 1 using the same. [Selection] Figure 1 |