http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008130784-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2cd796f8c4dcb425ddcc68707d3444 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate | 2006-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b994a9d0e27dfe5ee5ea5b24920afde http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fd4abc6a36a431192c7cb812aa0a9b8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67c7ebce5e7b407592403670fd8e6a74 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_666680f5646defad712fcf627b36cc16 |
| publicationDate | 2008-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008130784-A |
| titleOfInvention | Multilayer circuit board |
| abstract | PROBLEM TO BE SOLVED: To provide a multilayer circuit board having excellent stability against high temperature heating and the like, in particular, dimensional stability, high frequency characteristics, and high adhesion strength of a conductor pattern to a board. A circuit element board in which a conductor pattern is formed on an insulating layer composed of a first resin layer made of thermoplastic resin and a multilayer polyimide film which is a second resin layer having higher heat resistance than the first resin layer. Is a multilayer circuit board laminated in multiple layers, wherein the second resin layer is included in at least one layer in the multilayer circuit board, and the second resin layer is 4,4′-oxydiphthalic acid, aromatic diamine (A) layer which is an adhesive thermoplastic polyimide such as polyimide obtained by reacting 1,3-bis (4-aminophenoxy) benzene as a kind, pyromellitic acid and diamine having a benzoxazole skeleton are reacted. It is a multilayer polyimide film having a structure in which at least a layer (b) which is a polyimide having a high heat resistance and a low linear expansion coefficient such as polyimide obtained is laminated. Multi-layer circuit board. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102361753-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010085113-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010085113-A3 |
| priorityDate | 2006-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 186.