| abstract |
[PROBLEMS] To provide an adhesive resin composition that can be easily peeled off only by irradiation with light such as ultraviolet rays without causing adhesive residue even when heated, and an adhesive tape using the adhesive resin composition And a method of processing an electronic component using the adhesive tape. A pressure-sensitive adhesive binder polymer having a weight average molecular weight of 10,000 to 2,000,000 and a glass transition temperature of -100 ° C to 100 ° C, and one or more polymerizable carbon-carbon double bonds. The adhesive resin composition which has an adhesive layer containing the photopolymerizable monomer which has, a polyurethane (meth) acrylate oligomer more than hexafunctional, and a photoinitiator. [Selection figure] None |